The company has developed and patented a series of high performance technologies that address the higher speed, next generation architectures, where traditional methods of electrical interconnect and power management face performance limitations. The unique set of processes and technologies provide low cost yet high performance methods to interconnect and power the components contained in electronics devices.
HSIO has collaborated with leaders in the semiconductor and electronics industries to specifically serve select applications within the Computing, Telecommunications, Mobile & Wireless, Data Storage, Networking and Consumer Electronics industries.
The technology tool set provides high density small form factor circuit products with 35 micron lines and spaces and 10 micron feature sizes. The process improves the signal integrity, reduces cross talk, and impedance match by selectively plating structures to tune the impedance to 50 ohms for single ended environments, and 85 ohms for dual ended.